K & F ELECTRONICS

MANUFACTURING CAPABILITIES

TYPES OF BOARDS MANUFACTURED:  Single sided, double sided, multi-layer

MANUFACTURING VOLUMES:  1 piece prototypes through production volumes 

MAXIMUM NUMBER OF LAYERS:  24 

MAXIMUM BOARD SIZE:  17 x 23 inches 

MAXIMUM FINISHED BOARD THICKNESS:  .125” 

BOARD FLATNESS TOLERANCE:  .001 inch/inch 

MINIMUM HOLE SIZE:   .005

DRILLED VIA SIZE:   .010

ANNULAR RING:   .0075

FINISHED TRACE WIDTH:                               INSIDE:  .004                             OUTSIDE:  .006

SPACING BETWEEN TRACES:                       INSIDE:  .004                             OUTSIDE:  .006

SMT PITCH:   .012

COPPER TO BOARD EDGE:   .015 for scoring

BOARD FINISHES:  Bare copper, HASL, Gold, White Tin, Silver, OSP

SOLDER MASK:  Taiyo L.P.I. green, black, red, blue, yellow

CORE THICKNESS:  .004

MATERIAL TYPES:  FR-4, CEM-1, Teflon, Polyimide

CONTROLLED IMPEDANCE:  Yes

COPPER THICKNESS: (foil)  ½ oz. thru 4 oz.

MINIMUM DIELECTRIC THICKNESS:   .004

TESTING CAPABILITY:  Single sided, Double sided – double density

QUALITY SPECIFICATIONS:  MIL-Q-9858

CERTIFICATIONS:  ISO 9001 : 2000, UL

FACILITY DESCRIPTION:  Mfg. Sq.Ft. 15,000 – Total Sq.Ft. 20,000

K & F Electronics, Inc.
33041 Groesbeck Hwy
Fraser, MI. USA 48026-1514
Phone: 586.294.8720
Fax: 586.294.5999
info@circuitboards.com